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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject Anchoring polymer layer (APL)

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Showing results 1 to 5 of 5

1
A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20-mu m Fine-Pitch Interconnection

Lee, Sang-Hoon; Yoon, Dal-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.209 - 215, 2019-02

2
A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties

Byeon, Jun-Ho; Yoon, Dal Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.7, pp.1235 - 1243, 2019-07

3
Effects of Polyacrylonitrile Anchoring Polymer Layer Solder Anisotropic Conductive Films on the Solder Ball Movement for Fine-Pitch Flex-on-Flex (FOF) Assembly

Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.5, pp.830 - 835, 2019-05

4
Effects of the Nylon Anchoring Polymer Layer on the Conductive Particle Movements of Anisotropic Conductive Films for Ultrafine Pitch Chip-on-Glass Applications

Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.10, pp.1723 - 1728, 2018-10

5
Effects of the Types of Anisotropic Conductive Films on the Bending Reliability of Chip-in-Plastic Packages

Kim, Ji-Hyun; Kim, Ji-Hye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.3, pp.405 - 411, 2019-03

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