Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject AES
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| Effect of catalyst for nickel films for NiSi formation with improved interface roughness Kang, Hee-Sung; Ha, Jong-Bong; Lee, Jung-Hee; Choi, Chi Kyu; Lee, JeongYong; Lee, Kwang-Man, THIN SOLID FILMS, v.519, pp.6658 - 6661, 2011-08 |
| Effects of the Kirkendall Voiding on the Interfacial Reactions between Pb-free Solders and Electroplated Cu Film and Suppression of the Kirkendall Voiding in the Solder Joints = 전기도금된 구리와 무연솔더의 접합에서 Kirkendall void가 계면 반응에 미치는 영향과 Kirkendall void의 억제에 관한 연구link Kim, Sung-Hwan; 김성환; et al, 한국과학기술원, 2012 |
| Interface Properties of Nickel-silicide Films Deposited by Using Plasma-assisted Atomic Layer Deposition Lee, Kwang-Man; Kim, Chang Young; Choi, Chi Kyu; Yun, Sang-Won; Ha, Jong-Bong; Lee, Jung-Hee; Lee, JeongYong, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.55, no.3, pp.1153 - 1157, 2009-09 |
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