Effects of the Kirkendall Voiding on the Interfacial Reactions between Pb-free Solders and Electroplated Cu Film and Suppression of the Kirkendall Voiding in the Solder Joints = 전기도금된 구리와 무연솔더의 접합에서 Kirkendall void가 계면 반응에 미치는 영향과 Kirkendall void의 억제에 관한 연구

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Advisors
Yu, Jinresearcher유진
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
2012
Identifier
487114/325007  / 020085029
Language
eng
Description

학위논문(박사) - 한국과학기술원 : 신소재공학과, 2012.2, [ viii, 96 p. ]

Keywords

Solder; Kirkendall void; Diffusion; AES; 커켄달 보이드; 솔더; 확산; 오제분광기; 재결정; Recrystallization

URI
http://hdl.handle.net/10203/181946
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=487114&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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