Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Shih, Da-Yuan
Showing results 1 to 7 of 7
| An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate Seo, Sun-Kyoung; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.2, pp.257 - 265, 2009-02 |
| Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging Cho, Moon Gi; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1501 - 1509, 2007-11 |
| Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.534 - 543, 2009-02 |
| Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2242 - 2250, 2009-11 |
| The Crystal Orientation of beta-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.12, pp.2461 - 2469, 2009-12 |
| The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging Seo, Sun-Kyoung; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, MICROELECTRONICS RELIABILITY, v.49, no.3, pp.288 - 295, 2009-03 |
| 전기화학적 환원분석을 통한 무연 솔더합금의 산화에 대한 연구 조성일; 유진; 강성권; Shih, Da-Yuan, 마이크로전자 및 패키징학회지, v.12, no.1, pp.35 - 40, 2005-03 |
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