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Fine pitch chip on board (CoB) bonding using B-stage non-conductive film (NCF) for 3D TSV vertical interconnection

Choi, Yongwon; Shin, Ji-Won; Kim, Il; Kim, Young-soon; Paik, Kyung-Wook, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) , pp.186 - 191, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013), 2013-02-27

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