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Creep rupture of lead-free Sn-3.5Ag-Cu solders Joo, DK; Yu, Jin; Shin, SW, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.6, pp.541 - 547, 2003-06 |
Effects of microstructure on the creep properties of the lead-free Sn-3.5Ag-Cu solders Joo, DK; Yu, Jin, 52nd Electronic Components and Technology Conference, 2002, pp.1221 - 1225, 2002-05-28 |
Rupture time analyses of the Sn-3.5Ag solder alloys containing Cu or Bi Yu, Jin; Joo, DK; Shin, SW, ACTA MATERIALIA, v.50, no.17, pp.4315 - 4324, 2002-10 |
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