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Showing results 1 to 3 of 3

1
Development of Anhydride-based NCFs for Cu/Sn-Ag Eutectic Bonding and Process Optimization for Fine Pitch TSV Chip Stacking

Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Jee, Young Kun; Hwang, Ji Hwan; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, IEEE, 2012-05

2
Effect of NCFs with Zn-nanoparticles on the Interfacial Reactions of 40 um Pitch Cu pillar/Sn-Ag Bump for TSV Interconnection

Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kim, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1024 - 1030, The 63rd Electronic Components and Technology Conference, 2013-05-30

3
Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 mu m pitch Cu-pillar/Sn-Ag bump interconnection

Shin, Ji Won; Kim, Il; Choi, Yong-Won; Kim, Youngsoon; Kang, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.55, no.2, pp.432 - 441, 2015-02

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