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Showing results 1 to 11 of 11

1
A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag solders

Jee, YK; Sohn, YC; Yu, Jin; Lee, TY; Seo, HN; Kim, KH; Ahn, JH; et al, 2006 International Conference on Electronic Materials and Packaging, EMAP, pp.571 - 579, 2006-12-11

2
Comparative study of drop reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn solders

Jee, YK; Ko, YH; Yu, Jin; Lee, TY; Cho, MK; Lee, HM, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.957 - 961, 123, 2007-05-29

3
Comparison between Electroless Ni(P)Au and Cu OSP as a Surface Finish Layer of Mobile Application

Yu, Jin; Sohn, YC; Jee, YK; Seo, HS; Kim, KH; Ahn, JH; Lee, YM, IMAPS 2005 Proceedings, 2005

4
Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations

Jee, YK; Xia, YH; Yu, Jin; Kang, HW; Lee, TY, 58th Electronic Components and Technology Conference, ECTC 2008, pp.491 - 494, 2008-05-27

5
Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations

Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12

6
Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad

Jee, YK; Ko, YH; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.7, pp.1879 - 1887, 2007-07

7
Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints

Jee, YK; Yu, Jin; Ko, YH, JOURNAL OF MATERIALS RESEARCH, v.22, no.10, pp.2776 - 2784, 2007-10

8
Impact Reliabilities of Lead-free Solder Joints with Ni(P), Cu and Ni metallizations

Yu, Jin; Sohn, YC; Kim, JY; Jee, YK; Ko, YH, ICEP 2006, 2006

9
Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations

Jee, YK; Kim, JY; Yu, Jin; Lee, TY, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.S1-b p3 -, 2007-11-19

10
Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM

Jee, YK; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.10, pp.2286 - 2291, 2010-10

11
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package

Jee, YK; Park, KW; Oh, TS; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.5, pp.685 - 690, 2009-05

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