Comparative study of drop reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn solders
- Publisher
- 123
- Issue Date
- 2007-05-29
- Language
- English
- Citation
57th Electronic Components and Technology Conference 2007, ECTC '07, pp.957 - 961
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
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- There are no files associated with this item.
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