DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jee, YK | ko |
dc.contributor.author | Ko, YH | ko |
dc.contributor.author | Yu, Jin | ko |
dc.contributor.author | Lee, TY | ko |
dc.contributor.author | Cho, MK | ko |
dc.contributor.author | Lee, HM | ko |
dc.date.accessioned | 2013-03-19T01:19:53Z | - |
dc.date.available | 2013-03-19T01:19:53Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-05-29 | - |
dc.identifier.citation | 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.957 - 961 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/154419 | - |
dc.language | English | - |
dc.publisher | 123 | - |
dc.title | Comparative study of drop reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn solders | - |
dc.type | Conference | - |
dc.identifier.wosid | 000247705500145 | - |
dc.identifier.scopusid | 2-s2.0-35348901916 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 957 | - |
dc.citation.endingpage | 961 | - |
dc.citation.publicationname | 57th Electronic Components and Technology Conference 2007, ECTC '07 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Sparks, NV | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Jee, YK | - |
dc.contributor.nonIdAuthor | Ko, YH | - |
dc.contributor.nonIdAuthor | Lee, TY | - |
dc.contributor.nonIdAuthor | Cho, MK | - |
dc.contributor.nonIdAuthor | Lee, HM | - |
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