Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Jang, DM
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| Development and evaluation of 3-D SiP with vertically interconnected Through Silicon Vias (TSV) Jang, DM; Ryu, C; Lee, KY; Cho, BH; Kim, Joungho; Oh, TS; Lee, Won-Jong; et al, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.847 - 852, IEEE, 2007-05-29 |
| Effect of alloying W in Ni(5P) metallization of solder joints Jang, DM; Yu, Jin, 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.141 - 144, 2008-10-22 |
| Effects of W addition in Ni(P) UBM on the solder joint reliability Jang, DM; Yu, Jin, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
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