Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Hwang, JS
Showing results 1 to 14 of 14
| Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Hwang, JS; Kim, JG; Kim, HJ; Kwon, W; Jang, KW; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.159 - 164, IEEE, 2004-06-01 |
| Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application Hwang, JS; Yim, MJ; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.48, pp.293 - 299, 2008-02 |
| Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates Hwang, JS; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.1722 - 1727, 2006-09 |
| Effects of the partial pressure of copper (I) hexafluoroacetylacetonate trimethylvinylsilane on the chemical vapor deposition of copper Lee, SY; Rha, SK; Lee, WJ; Kim, DW; Hwang, JS; Park, Chong-Ook, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.36, pp.5249 - 5252, 1997-01 |
| Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications Yim, MJ; Jung, IH; Choi, HK; Kim, K; Hwang, JS; Ahn, JY; Kwon, W; et al, 53rd Electronic Components and Technology Conference 2003, pp.1398 - 1403, IEEE, 2003-05-27 |
| Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12 |
| High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications Yim, MJ; Hwang, JS; Kwon, WS; Jang, KW; Paik, Kyung-Wook, 2002 Electronic Components & Technology Conference , pp.1385 - 1389, 2002 Electronic Components & Technology Conference, 2002-05-28 |
| Highly Reliable Flip Chip on Flex Package using Multi-layered Anisotropic Conductive Film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002, pp.0 - 0, 2002-12 |
| Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.76 - 82, 2004-01 |
| Highly reliable non-conductive adhesives for flip chip CSP applications Yim, MJ; Hwang, JS; Kwon, W; Jang, KW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.26, pp.150 - 155, 2003-04 |
| Improved selectivity of oxide semiconductor type gas sensor using compensating element Bae, JS; Yun, DH; Park, Chong-Ook; Hwang, JS, SENSORS AND ACTUATORS B-CHEMICAL, v.75, no.3, pp.160 - 165, 2001-05 |
| NOx sensing properties of Ba2WO5 element at elevated temperature Kwak, MS; Hwang, JS; Park, Chong-Ook; Miura, N; Yamazoe, N, SENSORS AND ACTUATORS B-CHEMICAL, v.56, no.1-2, pp.59 - 64, 1999-06 |
| Properties of reactively sputtered WNx as Cu diffusion barrier Suh, BS; Lee, YJ; Hwang, JS; Park, Chong-Ook, THIN SOLID FILMS, v.348, no.1-2, pp.299 - 303, 1999-07 |
| Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs) Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07 |
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