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Showing results 1 to 5 of 5

1
Effect of Material Properties of Double-Layer Non Conductive Films (D-NCFs) On the Reflow Reliability of Ultra Fine-pitch Cu-pillar/Sn-Ag Micro Bump Interconnection

Lee, Seyong; Shin, JiWon; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2110 - 2115, IEEE-CPMT, 2017-06-01

2
Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn-Ag Bumps

Lee, Hanmin; Lee, Seyong; Choi, Taejin; Park, Sooin; Ko, Eun Kyoung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.5, pp.924 - 928, 2020-05

3
The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 mu m Fine-pitch Cu-pillar/SnAg Micro Bump Interconnection

Lee, Seyong; Lee, Hanmin; Park, JongHo; Shin, SangMyung; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.649 - 655, IEEE-CPMT, 2018-05-30

4
The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40-mu m Fine Pitch Cu-Pillar/Ni/SnAg Microbump Flip-Chip Assembly

Lee, SeYong; Park, JongHo; Park, Jae-Hyeong; Lee, HanMin; Shin, SangMyung; Kim, Youngsoon; Kim, Woojeong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.10 - 17, 2019-01

5
Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08

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