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1
Carbothermic synthesis of monodispersed spherical Si3N4/SiC nanocomposite powder

Choi, JY; Kim, CH; Kim, Do Kyung, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.82, no.10, pp.2665 - 2671, 1999-10

2
Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications

Son, HY; Jung, GJ; Lee, JK; Choi, JY; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871, IEEE, 2007-05-29

3
Effect Of B2O3 And HBN Crystallinity On CBN Synthesis

Choi, JY; Kang, Suk-Joong L; Fukunaga, O; Park, JK; Eun, KY, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.76, no.10, pp.2525 - 2528, 1993-10

4
Effect of carbon crystallinity on the nucleation and growth of diamond under high pressure and high temperature

Choi, JY; Eun, KY; Kim, JS; Kang, Suk-Joong L, DIAMOND AND RELATED MATERIALS, v.7, no.8, pp.1196 - 1200, 1998-08

5
Hydrothermal synthesis of spherical perovskite oxide powders using spherical gel powders

Choi, JY; Kim, CH; Kim, Do Kyung, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.81, no.5, pp.1353 - 1356, 1998-05

6
Lysozyme microencapsulation within biodegradable PLGA microspheres: Urea effect on protein release and stability

Nam, YoonSung; Song, SH; Choi, JY; Park, TG, BIOTECHNOLOGY AND BIOENGINEERING, v.70, no.3, pp.270 - 277, 2000-11

7
Orientations of polycrystalline ZnO at the buried interface of oxide thin film transistors (TFTs): A grazing incidence X-ray diffraction study

Kim, JY; Ko Park, Sang-Hee; Jeong, HY; Park, C; Choi, SY; Choi, JY; Han, SH; et al, BULLETIN OF THE KOREAN CHEMICAL SOCIETY, v.29, no.4, pp.727 - 728, 2008-04

8
Pyrolytic conversion of spherical organo-silica powder to silicon nitride under nitrogen

Choi, JY; Moon, YT; Kim, Do Kyung; Kim, CH, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.81, no.9, pp.2294 - 2300, 1998-09

9
SiC enhanced nucleation of diamond under high pressure and high temperature

Choi, JY; Park, JK; Eun, KY; Kang, Suk-Joong L, DIAMOND AND RELATED MATERIALS, v.5, no.10, pp.1214 - 1217, 1996-08

10
Studies on double-layered metal bumps for fine pitch flip chip applications

Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; et al, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11

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