Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject CU
Showing results 43 to 74 of 74
| Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints Nah, JW; Paik, Kyung-Wook; Suh, JO; Tu, KN, JOURNAL OF APPLIED PHYSICS, v.94, pp.7560 - 7566, 2003-12 |
| Metalorganic chemical vapor deposition of copper on ruthenium thin film Kwak, Dong-Kee; Lee, Hyun-Bae; Han, Jae-Won; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.9, no.10, pp.C171 - C173, 2006 |
| Microstructural evolution of joint interface between eutectic 80Au-20Sn solder and UBM Kim, SS; Kim, JH; Booh, SW; Kim, TG; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2400 - 2405, 2005-11 |
| Microstructure evolution of novel Sn islands prepared by electrodeposition as anode materials for lithium rechargeable batteries Kim, Ryoung-Hee; Kim, KiTae; Lim, Sung-Jin; Nam, Do-Hwan; Han, Dongwook; Kwon, HyukSang, RSC ADVANCES, v.7, no.48, pp.30428 - 30432, 2017 |
| Modulation of plastic flow in metallic glasses via nanoscale networks of chemical heterogeneities Kim, Jinwoo; Oh, Hyun Seok; Kim, Wan; Choi, Pyuck-Pa; Raabe, Dierk; Park, Eun Soo, ACTA MATERIALIA, v.140, pp.116 - 129, 2017-11 |
| New Sn-0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca Koo, Jahyun; Chang, Jaewon; Lee, Young Woo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ALLOYS AND COMPOUNDS, v.608, pp.126 - 132, 2014-09 |
| Non-oxidized bare copper nanoparticles with surface excess electrons in air Chung, Kyungwha; Bang, Joonho; Thacharon, Athira; Song, Hyun Yong; Kang, Se Hwang; Jang, Woo-Sung; Dhull, Neha; et al, NATURE NANOTECHNOLOGY, v.17, no.3, pp.285 - 291, 2022-03 |
| PEALD of a ruthenium adhesion layer for copper interconnects Kwon, OK; Kwon, SH; Park, HS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.12, pp.C753 - C756, 2004 |
| Performance improvement in CdTe solar cells by modifying the CdS/CdTe interface with a Cd treatment Yun, Jae Ho; Cha, Eun Seok; Ahn, Byung Tae; Kwon, Hyuk-Sang; Al-Ammar, Essam A., CURRENT APPLIED PHYSICS, v.14, no.4, pp.630 - 635, 2014-04 |
| Photoluminescence Enhancement of Synthesized ZnS-Based-Nanocrystals and Aging Effect on Its Emitting Color Han, Ji-Yeon; Kim, Dong-Hyuk; Kim, Hyun-Ki; Jeon, Duk-Young, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.12, no.2, pp.1323 - 1327, 2012-02 |
| Plasma-enhanced atomic layer deposition of Ru-TiN thin films for copper diffusion barrier metals Kwon, SH; Kwon, OK; Min, JS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.153, no.6, pp.G578 - G581, 2006 |
| Plasma-enhanced atomic layer deposition of ruthenium thin films Kwon, OK; Kwon, SH; Park, HS; Kang, SW, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.4, pp.C46 - C48, 2004 |
| Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.46, no.11, pp.777 - 781, 2002-06 |
| Reactive ion etching mechanism of copper film in chlorine-based electron cyclotron resonance plasma Lee, SK; Chun , Soung Soon; Hwang, CY; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.1A, pp.50 - 55, 1997-01 |
| Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films Chang, Jaewon; Kang, Sung K.; Lee, Jae-Ho; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.10, pp.3486 - 3499, 2015-10 |
| Residual stress effect on self-annealing of electroplated copper Lee, CH; Park, Chong-Ook, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.7, pp.4484 - 4488, 2003-07 |
| Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints Kim, Sung-Hwan; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.25, no.9, pp.1854 - 1858, 2010-09 |
| Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11 |
| Shear-Induced Mixing Governs Codeformation of Crystalline-Amorphous Nanolaminates Guo, Wei; Jaegle, Eric A; Choi, Pyuck-Pa; Yao, Jiahao; Kostka, Aleksander; Schneider, Jochen M; Raabe, Dierk, PHYSICAL REVIEW LETTERS, v.113, no.3, 2014-07 |
| Short-circuit current improvement in CdTe solar cells by combining a ZnO buffer layer and a solution back contact Cha, Eun Seok; Ko, Young Min; Kim, Seon Cheol; Ahn, Byung Tae, CURRENT APPLIED PHYSICS, v.17, no.1, pp.47 - 54, 2017-01 |
| STRUCTURAL-PROPERTIES AND INTERFACIAL LAYER FORMATION MECHANISMS OF PBTIO3 THIN-FILMS GROWN ON P-SI SUBSTRATES KIM, TW; YOON, YS; YOM, SS; Lee, JeongYong, APPLIED PHYSICS LETTERS, v.64, no.20, pp.2676 - 2678, 1994-05 |
| Study on the Mechanism and Modeling for Super-filling of High-Aspect-Ratio Features with Copper by Catalyst Enhanced Chemical Vapor Deposition Coupled with Plasma Treatment Kim, Chang-Gyu; Lee, Do-Seon; Lee, Won-Jong, KOREAN JOURNAL OF METALS AND MATERIALS, v.49, no.4, pp.334 - 341, 2011-04 |
| SURFACE-MORPHOLOGY AND INTERFACE STRUCTURE OF EX-SITU YBA2CU3O7-X THIN-FILMS SUNG, GY; SHU, JD; KANG, KY; Lee, JeongYong, JOURNAL OF MATERIALS SCIENCE LETTERS, v.14, no.2, pp.124 - 128, 1995-01 |
| Synthesis and characterization of colloidal metallic nanoparticles by chemical process = 화학공정법을 이용한 콜로이달 금속 나노입자의 합성 및 특성 평가link Mo, Chan-Bin; 모찬빈; et al, 한국과학기술원, 2004 |
| Synthesis of the combination solder of 80Au-20Sn/42Sn-58Bi and thermodynamic interpretation of the microstructural evolution Yang, Chang Joon; Cho, Moon Gi; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.49, no.2, pp.376 - 381, 2008-02 |
| Texture and sheet resistance of Al alloy thin films on Ti and TiN thin films Lee, WJ; Kim, SJ; Lee, WH; Lee, YJ; Lee, YS; Rha, SK; Park, Chong-Ook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.15, no.1, pp.9 - 13, 2004-01 |
| The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; Zhou, Hongzhi; Li, Rongqing; He, Peng; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11 |
| Thermodynamic assessment of the Ni-Bi binary system and phase equilibria of the Sn-Bi-Ni ternary system Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1536 - 1544, 2007-11 |
| Thermodynamic issues of lead-free soldering in electronic packaging Jeong, SW; Kim, JH; Lee, Hyuck-Mo, MATERIALS SCIENCE FORUM, v.426-4, pp.4081 - 4086, 2003 |
| Thermodynamic prediction of glass forming range in Al-Mg-REM ternary system Kim, YK; Soh, JR; Kim, HS; Lee, HyuckMo, CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, v.22, no.2, pp.221 - 230, 1998-06 |
| Tuning the C-1/C-2 Selectivity of Electrochemical CO2 Reduction on Cu-CeO2 Nanorods by Oxidation State Control Hong, Seungwon; Abbas, Hafiz Ghulam; Jang, Kyuseon; Patra, Kshirodra Kumar; Kim, Beomil; Choi, Byeong-Uk; Song, Hakhyeon; et al, ADVANCED MATERIALS, v.35, no.8, 2023-02 |
| (UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05 |
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