Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Shin, Ji-Won
Showing results 9 to 10 of 10
| Fine pitch chip on board (CoB) bonding using B-stage non-conductive film (NCF) for 3D TSV vertical interconnection Choi, Yongwon; Shin, Ji-Won; Kim, Il; Kim, Young-soon; Paik, Kyung-Wook, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) , pp.186 - 191, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013), 2013-02-27 |
| Reliability Improvement Methods of Solder Anisotropic Conductive Film (ACF) Joints Using Morphology Control of Solder ACF Joints Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Ji-Won; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-29 |
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