Showing results 3801 to 3820 of 7308
Long-range Stripe Nanodomains in Epitaxial BiFeO3 Thin Films on (100) NdGaO3 HONG, DANIEL SEUNGBUM, The International Meeting on Ferroelectricity (IMF-2017), University of Texas at San Antonio, 2017-09-06 |
Long-term Oxidation Properties of Al-Ti-Cr Two-Phase Alloys as Coating Materials for TiAl Alloy Wee, Dang-Moon, pp.927 - 930, 2001-01-01 |
Lost foam casting of Al-alloys Zin-Hyoung Lee, Proceedings of the 8th Asian Foundry Congress, pp.744 - 753, 2003 |
Low Cost, Scalable Nanoengineering by Directed Molecular Assembly Kim, Sang Ouk, International Conference on NanoScience and nanoTechnology (ICNST 2010), 2010-11-08 |
Low Current Switching Induced by Large Spin Orbit Torque of Tungsten 백승헌; 박경웅; 박병국, 제23회 한국반도체학술대회, 한국물리학회, 한국재료학회, 2016-02-24 |
Low Defect Preparation Methods of Graphene Jeon, Seokwoo, 8th Pacific Rim International Congress on Advanced Materials and Processing (PRICM-8), The Minerals, Metals & Materials Society (TMS), 2013-08-06 |
Low Dielectric Hybrid Inorganic-Organic Mesoporous Silicate Thin Films Bae, Byeong-Soo; Jung, JI; Bae, JY, XII International Workshop on Sol-Gel Science & Technology, 2003 |
Low Dielectric Hybrid Inorganic-Organic Mesoporous Silicate Thin Films 배병수; 정지인; 배재영, 한국재료학회 춘계학술대회, 한국재료학회, 2003 |
Low Dk/Df Siloxane Hybrid Material for High Performance Copper Clad Laminates of 5G Communication Devices 강승모; 엄병조; 장준호; 이현환; 배병수, 2022 한국세라믹학회 춘계학술대회, 한국세라믹학회, 2022-04-13 |
Low Dk/Df Siloxane Hybrid Polymer for High Performance Copper Clad Laminates of 5G Communication Devices 강승모; 엄병조; 장준호; 이현환; 배병수, 2021 한국고분자학회 추계학술대회, 한국고분자학회, 2021-10-21 |
Low power Flexible phase change memory through block copolymer self-assembly Mun, Beomho; You, Byoung Kuk; Yang, Seryeon; Yoo, Hyeon Gyun; Kim, Taejin; Byun, Myeonghwan; Lee, Keon Jae, 2016년도 한국재료학회 추계학술대회, 사단법인 한국재료학회, 2016-11-18 |
Low resistance and Low temperature Bonding between Silver and Indium 유진; Cho, SI; Kim, YH, 2nd Int. Meeting on Information Display, pp.275 - 278, 2002 |
Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology Kim, SY; Oh, TS; Lee, Won-Jong; Kim, YH, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, 2006-08-26 |
Low temperature annealed solution-processed oxide thin film transistor Bae, Byeong-Soo; S. Seo; Y. Hwang; J.Jeon, The International Chemical Congress of Pacific Basin Societies, PACIFICHEM 2010, 2010-12 |
Low temperature burnable CNT paste component for CNT-Field Emitter backlight unit Lee, S; Jeon, Duk Young, Technical Digest of the 17th International Vacuum Nanoelectronics Conference, IVNC 2004, pp.124 - 125, 2004-07-11 |
Low Temperature Camera Module Assembly Using Acrylic-based Solder ACFs with Ultrasonic-Assisted Thermo-Compression Bonding Method Kim, Yoo-Sun; Kim, Seung-Ho; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1613 - 1616, The 63rd Electronic Components and Technology Conference, 2013-05-29 |
Low Temperature Curable Anisotropic Conductive Films (ACFs) with Photo-active Curing Agent (PA-ACFs) Kim, Il; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, IEEE, 2012-05 |
Low temperature curable Sol-Gel based epoxy siloxane hybrid materials for led encapsulant Bae, Byeong-Soo; Kim, Hwea-yoon; Bae, Jun Young; Kim, YongHo, 2013 International Sol-Gel Conference, ISGS, 2013-08 |
Low Temperature Fabrication of Aqueous Solution Processed Flexible Indium Oxide Transparent Thin-Film Transistors on a Plastic Substra Bae, Byeong-Soo; Hwang, Young Hwan; Seo, Jin-Suk; Nam, Yun Yong; Ryu, Min Ki; Park, Sang-Hee Ko, 2012 International Meeting on Information Display, IMID, 2012-08 |
Low Temperature Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Sn58Bi Solder Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method Kim, Tae Wan; Suk, Kyung-Lim; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.461 - 467, The 63rd Electronic Components and Technology Conference, 2013-05-29 |
Discover