Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference
Showing results 1841 to 1860 of 7308
| Effects of Chloride Ion and Applied Current Density on the Stresses Generated during Anodic Oxidation of Tungsten by Using A Beam Deflection Technique 변수일, Korean Corros. Sci. Soc., pp.31 - 31, 1994 |
| Effects of Chloride Ion and Applied Potential on Repassivation Behaviour of Al-1wt.% Si-0.5wt.% Cu Alloy 변수일, Korean Corros. Sci. Soc., pp.21 - 21, 1992 |
| Effects of Chloride Ion and Applied Potential on the Corrosive Wear Behaviour of AISI-304L Stainless Steel 변수일, Korean Corros. Sci. Soc., pp.14 - 14, 1988 |
| Effects of Cl- doping on the Electrochemical Performances of LiMn1.5Ni0.5O4 Cathode Material for Li-ion Batteries Kim, Won-Keun; Ryu, Won-Hee; Han, Dong-Wook; Lim, Sung-Jin; Kwon, Hyuk-Sang, 62nd Annual Meeting of the International Society of Electrochemistry, International Society of Electrochemistry, 2011-09 |
| Effects of co catalysts on hydrogen generation properties from hydrolysis of sodium borohydride Cho, K; Eom, K; Kwon, Hyuk-Sang, 208th Meeting of The Electrochemical Society, pp.1789 -, ECS, 2005-10-16 |
| Effects of Co electroplating on the corrosion resistance of 310S cathode current collector in MCFC Kim, Min Joong; Youn, Ju Yong; Eom, Kwang Sup; Kwon Hyuk-Sang, The 7th Asian Conference on Electrochemistry, ICT in Education Victoria, 2010-05 |
| Effects of Co-P Catalysts on the Hydrogen Generation Properties from Hydrolysis of Sodium Borohydride Kwon, Hyuk Sang, Korea Conference on Innovative Science and Technology (KCIST-2005), pp.4 - 7, 2006-05-01 |
| Effects of Conductive Particles on the Power Handling Capability of ACFs Interconnection for Flex-On-Board Applications Zhang, Shuye; Park, Jae Hyeong; Paik, Kyung Wook, 15th International Symposium on Microelectronics and Packaging (ISMP 2016), The Korean Microelectronics and Packaging Society, 2016-10-25 |
| Effects of controlling crystallites of core/shell SiO2/Y 2O3:Eu3+ on its photoluminescence properties Yoo, HS; Jeon, Duk Young, 22nd International Vacuum Nanoelectronics Conference, IVNC 2009, pp.59 - 60, 2009-07-20 |
| Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability Zhang, Shuye; Paik, Kyung Wook, IEEE 66th Electronic Components and Technology Conference, pp.737 - 742, IEEE 66th Electronic Components and Technology Conference, 2016-06-02 |
| Effects of Cr and Al additions on the γ/γ′ forming Co-Ti-W based alloys 유보령; 최벽파, 2019 대한금속재료학회 춘계학술대회, 대한금속재료학회, 2019-04-25 |
| Effects of Cr and Al Additions on the Microstructure and Mechanical Properties of Co-Ti-W Based Alloys Yoo, Boryung; Im, Hye Ji; Sul, Jaebok; Choi, Pyuck-Pa, TMS 2019 Annual Meeting & Exhibition, The Minerals, Metals & Materials Society, 2019-03-12 |
| Effects of Cr on the structure of the passive films on Ni-(15, 30)Cr Jang, H; Kwon, Hyuk-Sang, Corrosion General Poster Session - 210th ECS Meeting, pp.1 - 11, ECS, 2006-10-29 |
| Effects of Cr2N on the pitting corrosion of high nitrogen stainless steel investigated by micro-droplet cell Ha H.Y.; Kwon, Hyuk-Sang, 208th Meeting of the Electrochemical Society, v.1, no.4, pp.391 - 399, 2005-10-16 |
| Effects of CsF Post-deposition Treatment on Cu(In, Ga)Se2 Thin Films and Solar Cells Lee, Hojin; Kim, Kihwan; Jang, Yuseong; Nam, Seong-Wook; Shin, Byungha, 46th IEEE Photovoltaic Specialists Conference, PVSC 2019, pp.622 - 625, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Effects of Cu on the Localized Corrosion and Repassivation Kinetics of Fe-20Cr-xCu (x=0, 1, 2 wt. %) Stainless Steels Ahn, SooHoon; Kwon, Hyuk-Sang, Corrosion 2012, NACE International, 2012-03 |
| Effects of Cu on the Passivity of Cu-containing steels in a dilute H2SO4 solution 오꽃님; 안수훈; 권혁상, 한국부식방식학회 창립 40주년 기념 국제심포지엄 및 2011년도 춘계학술대회, 한국부식방식학회, 2011-04 |
| Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability Kim, HJ; Lee, YJ; Paik, Kyung-Wook; Koh, KW; Woon, JH; Choi, SH; Lee, J; et al, Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging 2001, pp.44 - 51, International Symposium on Electronic Matericals and Packaging, 2001-11 |
| Effects of Cu1+/Cu2+ on Properties of Copper Phosphate Glass Bae, Byeong-Soo; Weinberg, MC, pp.352 - 356, 1993-11-01 |
| Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature Nah, JW; Suh, JO; Paik, Kyung-Wook; Tu, KN, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.50 - 53, 2005-03-16 |
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