Showing results 5661 to 5680 of 19454
Electrodeposited nanocrystalline Co-P alloys: Microstructural characterization and thermal stability da Silva, M.; Wille, C.; Klement, U.; Choi, Pyuck-Pa; Al-Kassab, T., MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.445, pp.31 - 39, 2007-02 |
Electrodeposition Cu and roll transfer of graphene for large scale fabrication of Cu-graphene nanolayered composite Kim, Sangmin; Kim, Wonsik; Hwangbo, Yun; Kim, Jae-Hyun; Han, Seung Min, 2D MATERIALS, v.6, no.3, pp.045051, 2019-09 |
Electrodeposition of amorphous MSx anode as Na-ion batteries anodes with enhanced reversibility Kim, TaeHee; Shin, JaeWook; Lee, Hoin; Cho, Eun Ae, ACEPS-9, The Korean Electrochemical Society, 2017-08 |
Electrodeposition of Co-P alloy calalysts and their hydrogen generation properties from hydrolysis of NaBH4 권혁상, 한국부식방식학회 추계학술대회, 한국부식방식학회, 2007-11 |
Electrodeposition of Microporous Co-P catalysts and their hydrogen generation chracteristics in alkaine NaBH4 solution Kwon, Hyuk-Sang, 211th ECS Meeting, ECS, 2007-05 |
Electrodeposition of multilayered sn dendrites and their electrochemical properties for Na-ion batteries anodes = 전해전착법을 이용한 다층 구조의 주석 수지상 제조 및 나트륨이차전지용 음극재료로서의 그 전기화학적 특성에 관한 연구link Kim, TaeHee; 김태희; et al, 한국과학기술원, 2016 |
Electrodeposition of pure Sn electrodes with various structures and their electrochemical performances for Na-ion batteries Kim, Tae Hee; Nam, Do Hwan; Hong, Kyung Sik; Sohn, Dongrak; Lim, Sung Jin; Kwon, Hyuk Sang; Cho, Eun Ae, 한국전기화학회 춘계총회 및 학술발표회, 한국전기화학회, 2016-04-08 |
Electrodeposition of Rhenium from Molten Salt 문산; 김주형; 김도경, 2013년 한국재료학회 추계 학술발표대회 및 제 24회 신소재 심포지엄, 한국재료학회, 2013-11-08 |
Electrodeposition of tungsten from ZnCl2-NaCl-KCl-WO3 melt and analysis on tungsten species in the melt Moon, San; Kim, Joo-Hyung; Kim, Do Kyung, 2013년 한국세라믹학회 춘계총회 및 연구발표회, 한국세라믹학회, 2013-04-18 |
Electrodeposition-enabled, electrically- transduced sensors and biosensors Choi, Eric J.; Drago, Nicholas P.; Humphrey, Nicholas J.; Van Houten, Justin; Ahn, Jaewan; Lee, Jiyoung; Kim, Il-Doo; et al, MATERIALS TODAY, v.62, pp.129 - 150, 2023-01 |
Electrodes with high power and high capacity for rechargeable lithium batteries Kang KS; Meng YS; Breger J; Grey CP; Ceder G, SCIENCE, v.311, no.5763, pp.977 - 980, 2006-02 |
Electrodes with High Power and High Capacity for Rechargeable Lithium Batteries Kang, Kisuk; Meng, Ying Shirley; Breger, Julien; Grey, Clare P.; Ceder, Gerbrand, Science, Vol.311, 2006-02 |
Electrodissolution Study of Al Thin Film with Microband Electrodes 변수일, Korean Corros. Sci. Soc., pp.10 - 10, 1992 |
Electrogravimetric Study on the Lithium Transport through the Li1-dCoO2 Film Electrode Prepared by R.F. Magnetron Sputtering Pyun, Su Il, International Symposium on New Materials for Electrochemical Systems, 2001 |
ELECTROHYDRAULIC FATIGUE APPARATUS FOR TESTING IN ULTRAHIGH-VACUUM AND CONTROLLED ENVIRONMENTS Lee, Won-Jong; CHUNG, YW; FINE, ME; BAKER, JP, REVIEW OF SCIENTIFIC INSTRUMENTS, v.57, no.11, pp.2854 - 2858, 1986-11 |
Electroless Bimetal Decoration on N-Doped Carbon Nanotubes and Graphene for Oxygen Reduction Reaction Catalysts Lee, Won Jun; Choi, Dong Sung; Lee, Sun Hwa; Lim, Joonwon; Kim, Ji Eun; Li, Dongjun; Lee, Gil Yong; et al, PARTICLE & PARTICLE SYSTEMS CHARACTERIZATION, v.31, no.9, pp.965 - 970, 2014-09 |
Electroless Ni Bumped Flip Chip Interconnection on an Organic Substrate using Anisotropic Conductive Adhesives/Films (ACAs/ACFs) Paik, Kyung-Wook, Int. Advanced Tech. Workshop on Flip Chip Technology, pp.0 - 0, 1999-03-01 |
Electroless Ni Plating Solutions for Reproducible Black Pad Analyses Yu, Jin, IMAPS 2013, IMAPS 2013, 2013-10-01 |
Electroless Ni-PUBM과 Sn-based 무연솔더의 계면반응에 미치는 Bi 합금원소의 영향 조문기; 전영두; 백경욱; 김중도; 김용남, 한국 마이크로 전자 및 패키징 학회 2003년도 추계 기술심포지움, 한국 마이크로 전자 및 패키징 학회, 2003-11-14 |
Electroless Ni-PUBM과 Sn-based 무연솔더의 계면반응에 미치는 Bi 합금원소의 영향 (Effects of Bi in Sn-based Pb Free solder interfacial reaction and Electroless Ni-PUBM) 조문기; 전영두; 백경욱; 김중도; 김용남, 한국 마이크로 전자 및 패키징 학회-(IMAPS-Korea) 2003년도 추계 기술심포지움, pp.128 - 132, 한국마이크로전자 및 패키징학회, 2003-11-14 |
Discover