DSpace at KOASAS: Novel sidewall interconnection using perpendicular circuit die with non-solder bumps for 3D chip stack

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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Novel sidewall interconnection using perpendicular circuit die with non-solder bumps for 3D chip stack

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Lee, Seung Seob researcher / Kim, Sun-Rak / Kim, Il / Lee, Jae Hak

Publisher: IEEE

Issue Date: 2012-05

Language: English

Citation: 2012 IEEE 62nd electronic Components and Technology Conference

DOI: 10.1109/ECTC.2012.6248994

URI: http://hdl.handle.net/10203/171387

Appears in Collection: ME-Conference Papers(학술회의논문)

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