DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Seung Seob | ko |
dc.contributor.author | Kim, Sun-Rak | ko |
dc.contributor.author | Kim, Il | ko |
dc.contributor.author | Lee, Jae Hak | ko |
dc.date.accessioned | 2013-03-29T14:28:45Z | - |
dc.date.available | 2013-03-29T14:28:45Z | - |
dc.date.created | 2012-10-30 | - |
dc.date.created | 2012-10-30 | - |
dc.date.issued | 2012-05 | - |
dc.identifier.citation | 2012 IEEE 62nd electronic Components and Technology Conference | - |
dc.identifier.uri | http://hdl.handle.net/10203/171387 | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | Novel sidewall interconnection using perpendicular circuit die with non-solder bumps for 3D chip stack | - |
dc.type | Conference | - |
dc.identifier.wosid | 000309162000198 | - |
dc.identifier.scopusid | 2-s2.0-84866879983 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 2012 IEEE 62nd electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | San Diego | - |
dc.identifier.doi | 10.1109/ECTC.2012.6248994 | - |
dc.contributor.localauthor | Lee, Seung Seob | - |
dc.contributor.nonIdAuthor | Kim, Sun-Rak | - |
dc.contributor.nonIdAuthor | Kim, Il | - |
dc.contributor.nonIdAuthor | Lee, Jae Hak | - |
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