Novel sidewall interconnection using perpendicular circuit die with non-solder bumps for 3D chip stack

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Publisher
IEEE
Issue Date
2012-05
Language
ENG
Citation

2012 IEEE 62nd electronic Components and Technology Conference

DOI
10.1109/ECTC.2012.6248994
URI
http://hdl.handle.net/10203/171387
Appears in Collection
ME-Conference Papers(학술회의논문)
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