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Showing results 1 to 4 of 4

1
Conformal, Wafer-Scale and Controlled Nanoscale Doping of Semiconductors Via the iCVD Process

Kim, Jae Hwan; Park, Hongkeun; Pak, Kwanyong; Yoon, Alexander; Kim, Yun Sang; Im, Sung Gap; Hwang, Wan Sik; et al, 64th IEEE International Electron Devices Meeting (IEDM 2018), IEEE, 2018-12-04

2
Selective Pore-Sealing of Highly Porous Ultralow-k dielectrics for ULSI Interconnects by Cyclic Initiated Chemical Vapor Deposition Process

Yoon, Seong Jun; Pak, Kwanyong; Ahn, Hyun Jun; Yoon, Alexander; Im, Sung Gap; Cho, Byung Jin, 38th IEEE Symposium on VLSI Technology, pp.73 - 74, IEEE, 2018-06

3
Surface-Localized Sealing of Porous Ultralow-k Dielectric Films with Ultrathin (<2 nm) Polymer Coating

Yoon, Seong Jun; Pak, Kwanyong; Taewook Nam; Yoon, Alexander; Kim, Hyungjun; Im, Sung Gap; Cho, Byung Jin, ACS NANO, v.11, no.8, pp.7841 - 7847, 2017-08

4
개시제를 통한 고분자 기상증착기법을 활용한 다공성 초절연물질 (k = 2.0) 표면 실링 방법

윤성준; 박관용; 남태욱; Yoon, Alexander; 김형준; 임성갑; 조병진, 24th Korean Conference on Semiconductors, SK Hynix, 2017-02-15

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