Showing results 1 to 4 of 4
A hyperelastic adhesive forming multiple neutral planes even at extreme temperatures Jeong, Kihoon; Kim, Dohun; AHN, DAHYE; Yang, Chanhee; Kim, Junmo; Lee, ChangHyeon; Kim, Youson; et al, CHEMICAL ENGINEERING JOURNAL, v.480, 2024-01 |
A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics Kim, Youson; Kim, Junmo; kim, chanyoung; Kim, Taehyun; Lee, Chungryeol; Jeong, Kihoon; Jo, Woosung; et al, CHEMICAL ENGINEERING JOURNAL, v.431, no.2, 2022-03 |
Thermally stable and soft pressure-sensitive adhesive for foldable electronics Jo, Woosung; Jeong, Kihoon; Park, Young-Sam; Lee, Jeong-Ik; Im, Sung Gap; Kim, Taek-Soo, CHEMICAL ENGINEERING JOURNAL, v.452, 2023-01 |
Vapor‑Phase Deposited Polymer Dielectric Layers for Organic Electronics: Design, Characteristics, and Applications Jang, Sukwon; Kim, Youson; Lee, Chungryeol; Nam, Taehyun; Park, Jeongik; Yang, Junyeong; Kim, Juchan; et al, Korean Journal of Chemical Engineering, 2024-07 |
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