소자의 부착력 감소를 위한 절연 액체 패키지 분위기An Insulating Liquid Package Environment for Adhesion force Reduction in Microelectromechanical System
- Publisher
- 한국MEMS학술대회
- Issue Date
- 2012-04-05
- Language
- KOR
- Citation
제14회 한국MEMS학술대회, pp.115 - 116
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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