소자의 부착력 감소를 위한 절연 액체 패키지 분위기An Insulating Liquid Package Environment for Adhesion force Reduction in Microelectromechanical System
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 고승덕 | - |
| dc.contributor.author | 이정언 | - |
| dc.contributor.author | 윤준보 | - |
| dc.date.accessioned | 2013-03-29T09:12:06Z | - |
| dc.date.available | 2013-03-29T09:12:06Z | - |
| dc.date.created | 2012-07-05 | - |
| dc.date.issued | 2012-04-05 | - |
| dc.identifier.citation | 제14회 한국MEMS학술대회, v., no., pp.115 - 116 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/169662 | - |
| dc.language | KOR | - |
| dc.publisher | 한국MEMS학술대회 | - |
| dc.title | 소자의 부착력 감소를 위한 절연 액체 패키지 분위기 | - |
| dc.title.alternative | An Insulating Liquid Package Environment for Adhesion force Reduction in Microelectromechanical System | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 115 | - |
| dc.citation.endingpage | 116 | - |
| dc.citation.publicationname | 제14회 한국MEMS학술대회 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 윤준보 | - |
| dc.contributor.nonIdAuthor | 고승덕 | - |
| dc.contributor.nonIdAuthor | 이정언 | - |
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