Thermosonic flip chip bonding using lateral vibration with anisotropic conductive film (ACF)

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Issue Date
2009-11-17
Language
ENG
Citation

2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, pp.113 - 117

URI
http://hdl.handle.net/10203/156759
Appears in Collection
ME-Conference Papers(학술회의논문)
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