Improving reliability of lateral thermosonic flip-chip bonding with ACF

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Publisher
123
Issue Date
2009-12-09
Language
English
Citation

2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.36 - 39

URI
http://hdl.handle.net/10203/156559
Appears in Collection
ME-Conference Papers(학술회의논문)
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