DSpace at KOASAS: Patterning of wafer level applied non-conductive adhesives (NCAs) for camera image sensor (CIS) modules

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Patterning of wafer level applied non-conductive adhesives (NCAs) for camera image sensor (CIS) modules

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Kim, I / Son, HY / Paik, Kyung-Wook researcher

Issue Date: 2009-05-26

Language: ENG

Citation: 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.1806 - 1810

URI: http://hdl.handle.net/10203/156505

Appears in Collection: MS-Conference Papers(학술회의논문)

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Patterning of wafer level applied non-conductive adhesives (NCAs) for camera image sensor (CIS) modules

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