The Microstructure and crystal orientation of Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P)
- Issue Date
- 2009-04-23
- Language
- KOR
- Citation
Korean Journal of Metal and Materials
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.