The Microstructure and crystal orientation of Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Hyuck Mo | - |
| dc.date.accessioned | 2013-03-26T00:08:04Z | - |
| dc.date.available | 2013-03-26T00:08:04Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-04-23 | - |
| dc.identifier.citation | Korean Journal of Metal and Materials, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/156268 | - |
| dc.language | KOR | - |
| dc.title | The Microstructure and crystal orientation of Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P) | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | Korean Journal of Metal and Materials | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Lee, Hyuck Mo | - |
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