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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

열압착 초음파 기법을 이용한 ACF 본딩기술 개발Development of ACF bonding using Thermo-compression Ultrasonic Technique

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정상원 / 장태영 / 윤원수 / 김경수researcher
Publisher
한국정밀공학회
Issue Date
2008
Language
KOR
Citation

한국정밀공학회 2008년 춘계학술대회, pp.933 - 934

URI
http://hdl.handle.net/10203/154769
Appears in Collection
ME-Conference Papers(학술회의논문)
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