횡방향 열초음파 기법을 이용한 ACF 플립칩 본딩 특성 규명Bonding Characteristics of Anisotropic Conductive Film (ACF) by Lateral Thermosonic Bonding Technology for Flip Chip Interconnection

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Publisher
한국정밀공학회
Issue Date
2009
Language
KOR
Citation

한국정밀공학회 2009년 학술발표대회, pp.1045 - 1046

URI
http://hdl.handle.net/10203/154069
Appears in Collection
ME-Conference Papers(학술회의논문)
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