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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Bumpless ball grid array (BBGA) package using a solder resist cavity

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Kwon, YM / Kang, JS / Kweon, YD / Paik, Kyung-Wookresearcher
Issue Date
2009-05-26
Language
ENG
Citation

59th Electronic Components and Technology Conference, 2009, pp.1552 - 1556

URI
http://hdl.handle.net/10203/153989
Appears in Collection
MS-Conference Papers(학술회의논문)
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