CCM용 플립칩 본딩을 위한 초음파 본딩 기술 개발Ultrasonic Flip-chip Bonding Technique for Compact Camera Module

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Publisher
한국정밀공학회
Issue Date
2006
Language
KOR
Citation

한국정밀공학회 2006년도 추계학술대회 , pp.645 - 646

URI
http://hdl.handle.net/10203/140342
Appears in Collection
ME-Conference Papers(학술회의논문)
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