Bubbles formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on ACFs joints reliability
- Issue Date
- 2005-12-07
- Language
- ENG
- Citation
7th Electronics Packaging Technology Conference, 2005, v.2, pp.734 - 739
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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