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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Creep and Relaxation Behaviors of SnAgCu vs 63/Sn/Pb Solder Joints on Wafer-Level CSP

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Lee, Soon-Bokresearcher / Ham, SJ / Kim, DH
Issue Date
2001
Language
ENG
Citation

URI
http://hdl.handle.net/10203/130415
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ME-Conference Papers(학술회의논문)
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