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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Creep and Relaxation Behaviors of SnAgCu vs 63/Sn/Pb Solder Joints on Wafer-Level CSP

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dc.contributor.authorLee, Soon-Bok-
dc.contributor.authorHam, SJ-
dc.contributor.authorKim, DH-
dc.date.accessioned2013-03-16T10:34:58Z-
dc.date.available2013-03-16T10:34:58Z-
dc.date.created2012-02-06-
dc.date.issued2001-
dc.identifier.citation, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/130415-
dc.languageENG-
dc.titleCreep and Relaxation Behaviors of SnAgCu vs 63/Sn/Pb Solder Joints on Wafer-Level CSP-
dc.typeConference-
dc.type.rimsCONF-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorHam, SJ-
dc.contributor.nonIdAuthorKim, DH-
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ME-Conference Papers(학술회의논문)
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