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ACF 패키지 구성물질에 대한 흡습 특성 연구 = A research for the moisture-induced properties of ACF package materialslink 윤지영; Yoon, Ji-Young; 이순복; 김일호; et al, 한국과학기술원, 2007 |
Measurement and Characterization of the Moisture-Induced Properties of ACF Package Yoon, Ji-Young; Kim, Ilho; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.131, no.2, pp.0210121 - 0210128, 2009-06 |
The Effect of Thickness on Thermal Properties and Behavior of Submicron Copper Film on Polymer Substrate Lee, Soon-Bok; Yoon, Ji-Young; Kim, Sung-Yeol, Tokyo Tech-KAIST joint workshop, pp.82 - 84, 2005 |
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