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Showing results 1 to 5 of 5

1
Adhesive joining of composite journal bearings to back-up metals

Kim, Seong Su; Yu, HN; Lee, Dai Gil, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, no.15-16, pp.3417 - 3424, 2007-12

2
Effects of the functional groups of nonconductive films (NCFs) on material properties and reliability of NCF flip-chip-on-organic boards

Chung, Chang-Kyu; Kwon, Woon-Seong; Jang, Kyung-Woon; Park, Jin-Flyoung; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.30, no.3, pp.464 - 471, 2007

3
Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구 = A study on the thermal deformations of wafer-level CSP assembly under power cyclinglink

조만석; Cho, Man-Seok; et al, 한국과학기술원, 2001

4
Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation

Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06

5
열변형 충격에 의한 텔레비전 마찰소음 저감에 관한 연구 = Reduction of frictional impulse noise induced by thermomechanical deformations in TV setslink

표준호; Pyo, Joon-Ho; et al, 한국과학기술원, 2005

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