Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구 = A study on the thermal deformations of wafer-level CSP assembly under power cycling

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Advisors
이순복researcherLee, Soon-Bokresearcher
Description
한국과학기술원 : 기계공학전공,
Publisher
한국과학기술원
Issue Date
2001
Identifier
165446/325007 / 000993518
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 기계공학전공, 2001.2, [ v, 71 p. ]

Keywords

전자 패키지; 열변형; 웨이퍼 레벨; 파워 사이클; 모아레; thermal deformation; chip scale; CSP; wafer-level; power cycling

URI
http://hdl.handle.net/10203/45223
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=165446&flag=dissertation
Appears in Collection
ME-Theses_Master(석사논문)
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