Showing results 1 to 4 of 4
A comparative study of the fatigue Behavior of SnAgCu and SnPb solder joints Kim, IH; Park, TS; Yang, SY; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, v.297-300, pp.831 - 836, 2005 |
A study on the thermal fatigue behavior of solder joints under power cycling conditions Yang, Se Young; Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.1, pp.3 - 12, 2008-03 |
Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구 = A study on the thermal deformations of wafer-level CSP assembly under power cyclinglink 조만석; Cho, Man-Seok; et al, 한국과학기술원, 2001 |
다양한 하중 조건에서 솔더 조인트의 신뢰성 평가 기술 및 수명 예측 모델 개발 = Development of the Evaluation Techniques and Life Prediction Model for Solder Joints under Various Loading Conditionslink 김일호; Kim, Il-ho; et al, 한국과학기술원, 2008 |
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