Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Park, JH
Showing results 1 to 13 of 13
| A feasibility study on indirect identification of transmission forces through rubber bushing in vehicle suspension system by using vibration signals measured on links Chae, CK; Bae, BK; Kim, Kwang-joon; Park, JH; Choe, NC, VEHICLE SYSTEM DYNAMICS, v.33, no.5, pp.327 - 349, 2000 |
| A flexure-guided scanner for an atomic force microscope: design and performance Lee, DY; Lee, MY; Park, JH; Gweon Dae Gab, Nanoengineering Symposium 2005, pp.360 - 365, 2005-10-28 |
| A study on an open architecture CNC system with a NURBS interpolator for WEDM Yang, Min-Yang; Park, JH, INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, v.19, no.9, pp.664 - 668, 2002 |
| Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF) Park, JH; Chung, CK; Paik, KW; Lee, Soon-Bok, International Confernce on Experimental Mechanics, 2006, v.326-328 I, pp.517 - 520, 2006 |
| Fracture toughness assessment of ACF flip-chip packages under high moisture condition with Moire interferometry Park, JH; Jang, JW; Jang, KW; Paik, KW; Lee, Soon-Bok, 2009 European Microelectronics and Packaging Conference, EMPC 2009, EMPC, 2009-06-15 |
| High resolution AFM Moire technique for the detection of defects in nano structure Park, JH; Lee, Soon-Bok, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| New estimation method of fatigue properties of aluminum alloys Park, JH; Song, Ji Ho, JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, v.125, no.2, pp.208 - 214, 2003-04 |
| New structures and techniques for easy axial loading test of static and fatigue properties of MEMS materials Park, JH; Kim, CY; Choa, SH; Lee, CS; Che, WS; Song, Ji Ho, KEY ENGINEERING MATERIALS, v.297-300, pp.545 - 550, 2005 |
| Novel micro-spiked needles with buried micro-channels for micro-scale biopsy Byun, S; Lim, JM; Paik, SJ; Lee, A; Koo, KI; Park, S; Park, JH; et al, Asia-Pacific Conf. of Transducers and Micro-Nano Tech., 2004-07 |
| Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire Park, JH; Jang, KW; Paik, KW; Lee, Soon-Bok, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638, 123, 2008-12-09 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09 |
| The KSTAR project: An advanced steady state superconducting tokamak experiment Lee, GS; Kim, J; Hwang, SM; Chang, Choong-Seock; Chang, Hong-Young; Cho, MH; Choi, BH; et al, NUCLEAR FUSION, v.40, pp.575 - 582, 2000-03 |
| Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008 |
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- 4,152 2020 - 2024
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- 10,774 2000 - 2009
- 6,220 1990 - 1999
- 1,879 1980 - 1989