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Development of Inclined Conductive Bump for Flip-Chip Interconnection Park, Ah-Young; Park, Seungbae; Yoo, Choong-Don, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.2, pp.207 - 216, 2015-02 |
Modification of pinch instability theory for analysis of spray mode in GMAW Park, Ah-Young; Kim, Sun-Rak; Hammad, Muhammad A.; Yoo, Choong Don, JOURNAL OF PHYSICS D-APPLIED PHYSICS, v.42, no.22, 2009-11 |
전자 패키징용 경사진 전도성 범프에 관한 연구 = A study on inclined conductive bump for electronic packaginglink 박아영; Park, Ah-Young; et al, 한국과학기술원, 2011 |
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