Showing results 1 to 1 of 1
A Non-contact Method to Measure Thermal Expansion Coefficient of PDMS for Soft Electronics Lee, Tae Ik; Kim, Cheol Gyu; Kim, MS; Kim, Taek Soo, The 14th International Symposium on Microelectronics and Packaging, ISMP 2015, 2015-10 |
Discover