Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Gu, Chang-Yeon
Showing results 1 to 6 of 6
| Effect of High-Temperature Exposure on the Thermo-Mechanical Behavior of Epoxy Molding Compound and Warpage of Molded Wafers Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ju, Min Sang; Kim, Taek-Soo, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, IEEE, 2023-06-02 |
| Effects of subsurface damage layer on flexural properties and reliability of thinned silicon wafers = 연마된 표면 아래의 손상층이 얇은 실리콘 웨이퍼의 굽힘 물성 및 신뢰성에 미치는 영향link Gu, Chang-Yeon; Kim, Taek-Soo; et al, 한국과학기술원, 2023 |
| Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ma, Sungwoo; Lee, Jin Hee; Lee, Woong-Sun; Kim, Taek-Soo, POLYMER TESTING, v.125, 2023-08 |
| Enhancing Predictability of Thermal Warpage of Molded Wafer by Applying Accurate Thermo-Mechanical Properties of Epoxy Molding Compound Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ma, Sung Woo; Jeong, Mu-Hyeon; Lee, Jin Hee; Lee, Woong-Sun; et al, The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, IEEE, 2023-03-08 |
| Mechanical Characterization of Collagen Hydrogels by Quasistatic Uniaxial Tensile Experiments Kim, JiEung; Lee, Sangmin; Gu, Chang-Yeon; Kim, Taek-Soo; Kong, Hyunjoon; Jang, Dongchan, ADVANCED ENGINEERING MATERIALS, v.25, no.21, 2023-11 |
| Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging Ju, Min Sang; Kim, Junmo; Gu, Chang-Yeon; Song, Myoung; Ma, Sung Woo; Lee, Jin Hee; Lee, Woong-Sun; et al, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27 |
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