Browse "Dept. of Mechanical Engineering(기계공학과)" by Author 668
Showing results 71 to 130 of 177
| Fatigue and failure prevention in machine design Lee, Soon-Bok, Proc. of Korea-U.S.A. Design Engineering Conference, pp.361 - 379, 1988 |
| Fatigue and Fracture Assessment for Reliability of Electronics Packaging Lee, Soon-Bok; Kim, Ilho, International Conference of Fracture, 2011-08-04 |
| Fatigue Behavior of Electrodeposited Nanocrystalline Nickel Films Lee, Soon-Bok; Baek, Dong-cheon, International Conf on Mechanical Behavior of Materials, ICM11, 2011-06 |
| Fatigue crack growth behavior of Mod.9Cr-1Mo steel at elevated temperatures: Effect of temperature, loading frequency and R ratio Lee, Jeong Hwan; Lee, Hyeong Yeon; Hong, Seong Gu; Lee, Soon Bok, Asian Conference on Experimental Mechanics(ACEM) 2016, KSME Materials and Fracture Division / Reliability Division, 2016-11-16 |
| Fatigue Crack Growth of Creep Damaged Specimens of Type 304 Stainless Steel Lee, Soon-Bok; Park, BS; Kim, JY, Int. Congress on Experimental Mechanics, pp.361 - 362, 1996 |
| Fatigue life assessment of bump type solder joint under vibration environment Lee, Soon-Bok; Ham, SJ, InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, pp.699 - 704, 1999-06-13 |
| Fatigue Strength Evaluation of Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints under Mixed Mode Loading Cases Park, Tae-Sang; Lee, Soon-Bok, KSME 2002 Conferece of Materials and Fracture Division, KSME 02MF026, pp.164 - 170, 2002 |
| Finite Element Analysis and X-ray Measurement of Residual Stresses of Ceramic/Metal Joints Lee, Soon-Bok; Kim, JH, Int. conf. on Mechanics and Materials Engineering (MSME-95), pp.498 - 503, 1995 |
| Flexing Effects on the Accelerated Life Testing of Hydraulic Hose 백동춘; 이순복; 강보식; 김형의, KSME Reliability Division Conference, 2008 |
| Flow Stress Derivation in Dynamic Strain Aging Region Lee, Keum-Oh; Hong, Seong-Gu; Lee, Soon-Bok, International Conference on Fatigue Damage of Structural Materials, 2006 |
| Fracture strength measrement of thin films for low-dimensional structures Lee, Soon-Bok; Back, Dong-Cheon, ICCES 2012, 2012-04-30 |
| Geometrical Effect of Thin Wall Pipe on Deformation Behavior and Low Cycle Faigue life of 429EM Stainless Steel Lee, Soon-Bok; Yoon, Samson; Hong, Seonggu; Lee, Keum-oh, Int. Conference on Fatigue Damage of Structural Materials, 2002 |
| Health monitoring method for electronic package using a simple Moire Interferometry Lee, Soon-Bok; Park, Jin-Hyung, ATEM'07 and ACEM6, 2007 |
| High mean stress effect on the high cycle fatigue behavior of gray cast iron for marine engine applications Lee, Soon-Bok; Hong, SG; An, SC; Park, JS; Kim, BY, Int. Conference on Fatigue Damage of Structural Materials, pp.47 -, 2004 |
| High resolution AFM Moire technique for the detection of defects in nano structure Park, JH; Lee, Soon-Bok, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| High temperature life prediction model for ferritic stainless steel using fracture mechanics Lee, Soon-Bok; Lee, Keum-Oh; Bae, KH; Lee, KO; Jin, MC; Park, SJ, Int. Conf. on Structural Engineering, Mechanics and Computation(SEMC), pp.239 - 240, 2007 |
| Highly Conductive Double-layer Graphene under Large Deformation Sejeong Won; Yun Hwangbo; Seung-Mo Lee; Seung-Ki Lee; Jong-Hyun Ahn; Hak-Joo Lee; Jae-Hyun Kim; et al, BIEN2013, BIEN2013, 2013-08-26 |
| Implementation of Thermo-Viscoplastic Constitutive Equations into the Finite Element Code ABAQUS Youn, SS; Lee, Soon-Bok; Kim, JB; Lee, HY; Yoo, B, Structural Mechanics in Reactor Technology, International SMiRT15, 1999 |
| Influence of Pre-straining on low cycle fatigue Behaviorof 316L Stainless steel in Dynamic strain aging regime Lee, Soon-Bok, , 2003 |
| Influence of strain rate on tensile and LCF properties of prior cold worked 316L stainless steel in dynamic strain aging regime Hong, SG; Lee, Soon-Bok, First International Conference on Fatigue Damage of Materials Experiment and Analysis, Fatigue Damage of Materials, pp.137 - 147, 2003-07-14 |
| Isothermal low cycle fatigue tests of Sn/3.5 Ag/0.75 Cu and 63Sn/37Pb solder joints under mixed-mode loading cases Park, TS; Lee, Soon-Bok, 52nd Electronic Components and Technology Conference, pp.979 - 984, 2002-05-28 |
| Low cycle fatigue analysis temperature dffects in Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints Lee, Soon-Bok; Park, TS, TMA Conference, 2003 |
| Low-cycle fatigue behavior of cyclically non-stabilized 316L stainless steel : Influence of temperature Lee, Soon-Bok; Hong, Seong-Gu, 2004 KSME confernece of Materials and Fractures Division, KSME04MF33, pp.196 - 201, 2004 |
| Low-Cycle Fatigue life prediction using Tomkins Model Lee, Soon-Bok; Lee, Keum-Oh, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Material Characterization of Lead-Free Solder Materials Lee, Soon-Bok; Hwang, Tae-Kyung, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Material Characterization of Thin Film in MEMS Structures Lee, Soon-Bok, Micro- Nano (includes Bio-) Technology, UM-KAIST Joint Workshop, pp.1 - 20, 2004 |
| Measurement of Mechanical Properties of Electroplated Nickel Thin Film for MEMS Application Back, DC; Park, TS; Lee, Soon-Bok; Lee, NK; Choi, TH; Na, KH, KSME 2003 Spring Conference, 2003 |
| Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry Ham, SJ; Hwang, TK; Lee, Soon-Bok, SEMICON Korea Technical Symposium 2001, Serial 14, pp.239 - 244, 2001 |
| Measurement of Thermal Deformations of Electronic packages using Moire Interferometry Lee, Soon-Bok; Ham, SJ, KSME 2000 Conference of Materials and Frcture Division, pp.314 - 320, 2000 |
| Measurement of Thermomechanical Behavior of Solder Joint under Power Cycling Condition using Moire Interferometry Lee, Soon-Bok; Yang, Se Young; Kim, Ilho, SEM'04, 2004 |
| Measurement of Thermomechanical Behavior of Solder Joints under Power cycling Condition Using Moire Interferometry Lee, Soon-Bok; Yang, Se Young; Kim, Ilho, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Measurement of Thermomechanical Behaviors of Wafer-Level CSPAssembly under Temperature Cycling Condition Ham, Suk-Jin; Lee, Soon-Bok, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.323 - 327, 2001 |
| Mechanical Behavior of Metallic Submicron Film on Polyimide Substrate:Stress Analysis and Experimental Techniques Lee, Soon-Bok; Baek, Dong Cheon, Tokyo Tech-KAIST joint workshop, pp.58 - 59, 2005 |
| Mechanical behavior of metallic thin film on polyimide substrate Baek, Dong-Cheon; Kim, Sung-Yeol; Lee, Soon-Bok, ECF16, pp.370 -, 2006 |
| Mechanical behavior of submicron metallic thin film on polymer substrate:stress analysis and tensile testing Lee, Soon-Bok; Baek, Dong-Cheon; Kim, Sung-Yeol, 2005 KSME spring conference, 05S016, pp.10 - 10, 2005 |
| Mechanical Fatigue Tests of Solder Joints under Mixed-Mode Loading Cases Park, Tae-Sang; Lee, Soon-Bok, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.438 - 443, 2001 |
| Mechanical Properties of Thin Film for MEMS Application Lee, Soon-Bok; Baek, Dong-Cheon; Park, Tae-Sang, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Mechanical Reliability of Electronics Packaging Lee, Soon-Bok; Ham, SJ, pp.3 - 45, 2001 |
| Mechanicsl behavior of lead-free solder materials with various microstructures Lee, Soon-Bok; Hwang, Tae-Kyung, Tokyo Tech-KAIST joint workshop, pp.24 - 25, 2005 |
| Mechanicsl Bending Fatigue Reliability Using a Electromagnetic Actuator Lee, Soon-Bok; Kim, Ilho, Tokyo Tech-KAIST joint workshop, pp.72 - 73, 2005 |
| Micromecanical Testings for Reliability of Electronic Packaging Lee, Soon-Bok; Ham, Suk-Jin, ICMAT2001, 2001 |
| Micromechanical Testing for Fatigue Reliability of Electronic Packaging Lee, Soon-Bok; Ham, SJ, Int. Conf. on ADVANCED TECHNOLOGY IN EXPERIMENTAL MECHANICS, ATEM'97, pp.355 - 360, 1997 |
| Model for prediction of Fatigue crack closure load considering roughness-induced closure and plsticity-induced closure Lee, Soon-Bok; Kim, JH, KSME 2000 Conference of Materials and Fracture Division KSME 00MF064, pp.136 - 141, 2000 |
| Modeling of Materials Behavior of HIP Superalloys for Liquid Rocket Engine Turbopump Applications Lee, Soon-Bok; Lee, KO; Bae, KH; Yoon, SH; Jeon, SM; Kim, J, IVK, ULB,European Conference for Aerospace Science (EUCASS), 2007 |
| Nemerical Analysis of Coined Eutectic Solder Bumps Lee, Soon-Bok; Hwang, TK; NAH, JW; Paik, KW, KSME 2002 Conference of Materials and Fracture Division,KSME 02MF025, pp.158 - 163, 2002 |
| Numerical Analysis of Coined Eutectic Solder Bumps Hwang, Tae-Kyung; Nah, Jae-Woong; Paik, Kyung-Wook; Lee, Soon-Bok, KSME 2002 Conference of Materials and Fracture Division, KSME 02MF025, pp.158 - 163, 2002 |
| Numerical Simulation of the Formation of Coined Solder Bump Hwang, T.K; Lee, Soon-Bok; Nah, JW; Paik, KW, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.388 - 392, 2001 |
| On a Crack Problem of Fretting Fatigue Lee, Soon-Bok; Lee, BH; Kim, HK; Seo, KS; Sohn, DS, Asian Pacific Conference for Fracture and Strength'96, (APCFS'96), pp.203 - 208, 1996 |
| Out-of-Phase, Combined bending and torsion fatigue of steels Lee, Soon-Bok, Biaxial and Multiaxial Fatigue, pp.623 - 641, 1989 |
| Oxidation assisted fatigue crack growth in modified 9Cr-Mo Steel at elevated temperature Lee, Soon-Bok; Lee, H.Y.; Lee, J.H., International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics 2014, 2014-11-17 |
| Positive energy method in life prediction of gray cast iron and spheroidal cast iron at elevated temperatures Lee, Soon-Bok; Lee, KO, Fatigue Damage of Structural Materials VII, 2008 |
| Prediction of Thermomechanical Behavior of the AISI316L Stainless Steel Yoon, S; Hong, SG; Lee, Soon-Bok, ASTM Thermomechancal Fatigue Behavior of Materials, pp.16 - 17, 2001 |
| Profiles of self stress and load stress at notches Fuchs, HO; Lee, Soon-Bok, Fatigue '87, pp.1009 - 1018, 1987 |
| Random Thermomechanical Fatigue Deformations Analysis Lee, Keum-Oh; Lee, Soon-Bok, International Conference on Fatigue Damage of Structural Materials, 2006 |
| Rayleigh Wave Transmission Characteristics of Continuous Caasting Slab for Medium Carbon Steel Lee, Soon-Bok; Lee, Jun-Youn, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Real-time reliability monitoring system in electronic package by using interferometric moire Park, Jin-Hyoung; Lee, Soon-Bok, 2006 KSME Spring Conference, 2006-06 |
| Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load Kim, I; Lee, Soon-Bok, IEEE Transactions on Components and Packaging Technologies, pp.478 - 484, 2005 |
| Reliability Assessment of Advanced Electronics Packaging and MEMS(Key-Note Speech) Lee, Soon-Bok, Tokyo Tech-KAIST joint workshop, pp.3 - 4, 2005 |
| Reliability assessment of advanced materials and structures Lee, Soon-Bok, APCMM09, 2009-11 |
| Reliability assessment of BGA solder joints under cyclic bending loads Kim, Ilho; Lee, Soon-Bok, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.27 - 32, 2005-12-11 |
Discover
Open Access
Date issued
- 4,101 2020 - 2024
- 12,323 2010 - 2019
- 10,774 2000 - 2009
- 6,220 1990 - 1999
- 1,879 1980 - 1989