DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yim, MJ | ko |
dc.contributor.author | Jeong, IH | ko |
dc.contributor.author | Choi, HK | ko |
dc.contributor.author | Hwang, JS | ko |
dc.contributor.author | Ahn, JY | ko |
dc.contributor.author | Kwon, W | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2007-09-03T02:16:00Z | - |
dc.date.available | 2007-09-03T02:16:00Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-12 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796 | - |
dc.identifier.issn | 1521-3331 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1215 | - |
dc.description.abstract | Anisotropic conductive adhesives (ACAs) are as promising interconnect materials for flip chip assembly in low cost, high-density, high-speed interconnection packages. We evaluated and compared several flip chip interconnects that use ACAs at the radio frequency (RF) and high-frequency range. The performance of high-speed circuits is limited by the package interconnect discontinuity which is due to large inductance and resistance in the high-frequency range. This discontinuity is determined by the interconnection geometry and materials used. For bumps on the integrated circuit (IC), we used An studs, An electroplated and electroless Ni/Au bumps, for the interconnection adhesives, we used two kinds of anisotropic conductive film (ACF) with a different dielectric constant. To evaluate the high frequency model parameters, which we based on an ACF flip chip model and network analysis, we took the high-frequency measurements of test flip chip vehicles that used different bonding materials. Furthermore, to demonstrate real applications for an ACF interconnection at the RF and high-frequency range, we applied ACF flip chip technologies to assemble a passive device that uses an RF integrated passive device. We also applied these technologies to an. active device that uses a highly integrated monolithic microwave IC device on an RF module. Moreover, we compared the high-frequency characteristics of these devices with those of flip chip assemblies fabricated with conventional methods such as solder ball interconnection. | - |
dc.description.sponsorship | Thisworkwas supported by the Center for Electronic Packaging Materials (CEPM), Korea Science and Engineering Foundation. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | COMPOSITES | - |
dc.title | Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications | - |
dc.type | Article | - |
dc.identifier.wosid | 000233756200032 | - |
dc.identifier.scopusid | 2-s2.0-29244464702 | - |
dc.type.rims | ART | - |
dc.citation.volume | 28 | - |
dc.citation.beginningpage | 789 | - |
dc.citation.endingpage | 796 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | - |
dc.identifier.doi | 10.1109/TCAPT.2005.859750 | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Yim, MJ | - |
dc.contributor.nonIdAuthor | Jeong, IH | - |
dc.contributor.nonIdAuthor | Choi, HK | - |
dc.contributor.nonIdAuthor | Hwang, JS | - |
dc.contributor.nonIdAuthor | Ahn, JY | - |
dc.contributor.nonIdAuthor | Kwon, W | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | anisotropic conductive film (ACF) | - |
dc.subject.keywordAuthor | flip chip | - |
dc.subject.keywordAuthor | high-frequency | - |
dc.subject.keywordAuthor | reliability | - |
dc.subject.keywordPlus | COMPOSITES | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.