충전제의 형상과 부피비에 따른 반도체 패키지용 EMC의 기계적 성질 및 열응력 해석Material properties and thermal stress analysis of EMC with different filler shape and volume fraction in electronic packaging
- Publisher
- 대한기계학회
- Issue Date
- 1996-08
- Language
- KOR
- Citation
대한기계학회 19996년 학술대회, pp.21 - 26
- Appears in Collection
- ME-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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