충전제의 형상과 부피비에 따른 반도체 패키지용 EMC의 기계적 성질 및 열응력 해석Material properties and thermal stress analysis of EMC with different filler shape and volume fraction in electronic packaging

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Publisher
대한기계학회
Issue Date
1996-08
Language
KOR
Citation

대한기계학회 19996년 학술대회, pp.21 - 26

URI
http://hdl.handle.net/10203/119587
Appears in Collection
ME-Conference Papers(학술회의논문)
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