Experimental evaluation of anodic bonding process using Taguchi method for maximum interfacial fracture toughness

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 249
  • Download : 0
Issue Date
1998-01-25
Language
ENG
Citation

Proceedings of the IEEE 11th Annual International Workshop on Micro Electro Mechanical Systems, 1998, pp.318 - 321

URI
http://hdl.handle.net/10203/115419
Appears in Collection
BiS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0